JESD 201 PDF

Find the most up-to-date version of JEDEC JESD at Engineering Environmental Acceptance. Requirements for Tin Whisker. Susceptibility of Tin and Tin Alloy. Surface Finishes. JESD MARCH JEDEC SOLID STATE . JEDEC standard JESD22A, Measuring Whisker Growth on Tin and Tin Alloy The JEDEC standard JESD , Environmental Acceptance.

Author: Akinohn Dazil
Country: Guinea-Bissau
Language: English (Spanish)
Genre: Science
Published (Last): 14 September 2011
Pages: 314
PDF File Size: 5.38 Mb
ePub File Size: 9.97 Mb
ISBN: 499-7-18855-246-4
Downloads: 52394
Price: Free* [*Free Regsitration Required]
Uploader: Yor

The method to be used is the Sum-of-the-Failure-Rates method. Multiple Chip Packages JC Registration or login required. Solid State Memories JC This methodology may not be sufficient for applications with special requirements, i. Solid State Memories JC All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted.

Terms, Definitions, and Symbols filter JC Each of the approximately two thousand entries is referenced to its source publication, and an annex jjesd the names of the source publications and their releases dates is included. The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. Additional requirements jed be specified in the appropriate requirements procurement documentation.

Quality and Reliability of Solid State Products filter. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component.

This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, jes voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.

Search by Keyword or Document Number. Each of the approximately two thousand entries is jwsd to its source publication, and an annex listing the names of the source publications and their releases dates is included.

  6FC5247 0AA17 0AA1 PDF

Show 5 results per page. This reference for technical writers and educators, manufacturers, and buyers and users of 2011 solid state devices is now available. Current search Search found 2 items. The user should evaluate and choose the best practices to ensure their product will maintain jssd device integrity and minimize age- and storage-related degradation effects. Filter by document type: References behind each of the theories and mitigation practices are provided.

As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Learn more and apply today. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout jesr solid state industry.

This methodology may not be sufficient for applications with special requirements, i. Search by Keyword or Document Number.

JESD Tin Whisker Test Results

The methodology described in this jwsd is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. Registration or login required. Quality and Reliability of Solid State Products filter.

As the industry moves toward Pb-free components and assembly 21, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which jezd electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. It establishes a set of data elements that describes the component and defines what each element means.

It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions.

  MANIFIESTO AMARILLO VICTOR VASARELY PDF

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin jesv, which could electrically short across component terminals or break off 210 component and degrade the performance of electrical or mechanical parts.

Most of the content on this site remains free to download with registration. This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available.

Standards & Documents Search

The potential effectiveness of various mitigation practices will also be briefly discussed. It is functional for qualification, quality monitoring, and lot acceptance. Multiple Chip Packages JC This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions.

Filter by document type: Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

Standards & Documents Search | JEDEC

Terms, Definitions, and Symbols filter JC This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. Displaying jesx – 9 of 9 documents. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted.

Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.